Volume 33, Issue 1 (Journal of Advanced Materials- Summer 2014)                   jame 2014, 33(1): 63-76 | Back to browse issues page

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S.S. Sayyedain, H.R. SalimiJazi, M.R. Toroghinejad, F. Karimzadeh.. Analyzing Mechanical Properties of Transient Liquid Phase Bonding of Al2O3p/Al Nanocomposite Using Copper Interlayer. jame. 2014; 33 (1) :63-76
URL: http://jame.iut.ac.ir/article-1-570-en.html
Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156-83111, Iran , s.sayedain@gmail.com
Abstract:   (6729 Views)
Due to their superior properties such as high specific strength, high creep resistance and high strength at elevated temperatures, aluminum composites reinforced with alumina nano particles are widely used for advanced purposes such as aerospace and auto industries. Lack of an appropriate welding process limits their applications. Transient liquid phase (TLP) bonding is one of the state-of-the-art joining processes. It is used for welding composites and advanced materials. Microstructure and mechanical properties of TLP bonding depend on the bonding time and temperature. In the current study, the effect of bonding time on the microstructure and bonding strength of the TLP diffusion bonded of Al2O3p/Al nanocomposite was investigated. A thin layer of copper deposited by electroplating was used as an interlayer. The bonding times of 20 and 40 min were not sufficient for completing the isothermal solidification, and the bonding strengths were not satisfactory. By increasing the bonding time to 60 min at constant bonding temperature of 580 ºC, the isothermal solidification was completed and the final joint microstructure consisted of soft α-Al phase with dispersed CuAl2 precipitated particles. Decreasing the amount of brittle eutectic structures in the joint seam by increasing the bonding time was the main reason for improvement of the joint shear strength. The maximum joint shear strength was achieved at 580 ºC for 60 min which was about 85% of the shear strength of the base material.
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Type of Study: Research | Subject: General
Received: 2015/02/9 | Accepted: 2015/05/6 | Published: 2015/05/6

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