بررسی تشکیل ترکیبات بین‌‌فلزی در ریخته‌گری مرکب دوفلزی مس و آلومینیوم

نویسندگان

دانشکده مهندسی مواد، دانشگاه آزاد اسلامی، واحد کرج

چکیده

هدف از این مقاله، بررسی تشکیل ترکیبات بین‌فلزی در فصل مشترک دوفلزی آلومینیوم و مس است که از روش ریخته‌گری مرکب مذاب آلومینیوم درون لوله مسی جامد تولید می‌شوند. مکانیزم تشکیل ترکیبات بین‌فلزی در فصل مشترک و اثرات دمای بارریزی مذاب آلومینیوم و دمای پیشگرم لوله مسی جامد بر نوع و ضخامت ترکیبات بین‌فلزی بررسی شد و ریزساختار فصل مشترک Al/Cu به‌وسیله میکروسکوپ نوری و رِیزتحلیلگر پروب الکترونی (EPMA) شناسایی شد. نتایج مبین این است که فصل مشترک از سه لایه اصلی شامل لایه I ترکیب یوتکتیک α-Al/Al2Cu ، لایه II ترکیب بین‌فلزی Al2Cu(θ) و لایه III شامل چندین ترکیب بین‌فلزی مانند AlCu، Al3Cu4، Al2Cu3 و Al4Cu9 تشکیل شده است. با توجه به ترکیب هایپریوتکتیک مذاب، در فصل مشترک ابتدا لایه II با مکانیزم جوانه زنی و رشد فاز θ، سپس لایه I با مکانیزم انحلال و انجماد و در انتها لایه III با مکانیزم استحاله فازی حالت جامد به‌وجود آمده است. افزایش دمای مذاب آلومینیوم و پیشگرم مس جامد منجر به افزایش ضخامت ترکیبات بین‌فلزی در فصل مشترک و در نتیجه افزایش مقاومت الکتریکی ویژه و کاهش استحکام پیوند Al/Cu شد که با توجه به نتایج آزمون تجربی به نظر می‌رسد استحکام پیوند تحت تأثیر ضخامت لایه‌های II و III باشد.

کلیدواژه‌ها


عنوان مقاله [English]

Investigating Formation of Intermetallics in Compound Casting of Al/Cu Bimetals

نویسندگان [English]

  • S. Tavassoli
  • R. Tahavvori
Department of Materials Engineering, Islamic Azad University of Karaj, Karaj, Iran
چکیده [English]

The purpose of this article is to study the formation of intermetallic compounds (IMCs) at the interface of Al/Cu bimetal produced by compound casting of molten Al in solid copper tubes. The mechanism of the intermetallic compounds formations at the interface, the effects of molten aluminum pouring temperature and solid copper tubes preheating tempreture, were investigated on the IMCs type and thickness and Al/Cu interface microstructures were characterized by optical microscope (OM) and electron probe micro-analyzer (EPMA). Results show that the interface consists of three main layers, where Layer (I) is α-Al/Al2Cu eutectic structure, layer (II) is intermetal of Al2Cu and layer (III) constituites several intermetallic compounds such as AlCu, Al3Cu4, Al2Cu3 and Al4Cu9. Considering the components of hypereutectic melt at the interface, initially layer (II) was formed by θ phase nucleation and growth mechanism, then layer (I) was formed by Al and Cu dissolving and solidification. Finally layer (III) was formed by solid-state phase diffusion. Raising molten Al temperature and preheating solid Cu leads to increase of the intermetallic compounds thickness at interface which consequently increases the specific electrical resistance and decreases the Al/Cu bond strength. From experimental results it seems that the bond strength is affected by the thicknesses of layer II and III.

کلیدواژه‌ها [English]

  • Compound casting
  • Al-Cu bimetal
  • Intermetallic compound formation
  • Bond strength
  • Microhardness
  • electrical resistivity
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